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The DB100 is a precision semi-automatic Die Bonder and has been designed for the handling of delicate GaAs and similar materials using a pulse heating system, for rapid heat up and cool down of bond temperature.
 The machine utilizes a dedicated programmable controller system and the user-friendly software allows easy setup and operation. All operating parameters are fully adjustable via the controller and can be stored onto disk.
A simple key pad, with joystick, is used by the operator for easy die and submount alignment whilst viewing the colour monitor.
DIE HANDLING
The precision vertical pickup arm is motor-driven, allowing precise height control and variable bond force from 10-100 grams.
The pickup arm also contains the die and submount pickup assemblies. Vacuum tools and pyramid-type collets can be supplied to suit particular applications.
COMPONENT PRESENTATION
Die and submount can be presented to the DB100 in either waffle or gel pack. A third tray position is also available for placing of bonded die and submount assemblies, thus eliminating the need for manual component handling.
PRECISION PLACEMENT
The die presentation and pulse heated workholder stages are mounted on a precision X, Y & Ø stage, ensuring a placement accuracy to within 5 microns.
The pulse heating system is carried out automatically under program control whilst the die is held in position on the submount.
A cover gas ensures an oxidation-free environment during the critical bonding process.
The background and bond temperatures are fully adjustable up to 400° Centigrade to cater for differing bonding materials and the bond temperature is precisely controlled by variable time and power using a digital controller.
CAMERA SYSTEM
A high magnification camera and lens system with colour monitor is used for precise die and submount pickup and placement.
Component illumination is provided using a fibre optic lighting ring. However, both camera and lighting system can be customized to suit particular applications.
FLIP CHIP BONDING
The DB100 can be configured for precise flip chip bonding of GaAs and similar delicate devices onto submounts.
A ssecond camera is mounted on the workstage to view the die located on the pickup tool, thus providing accurate alignment of the device in X, Y, & Ø prior to bonding under program control.
PATTERN RECOGNITION VISION SYSTEM
With the addition of a high speed pattern recognition system the DB100 can be upgraded to provide fully automatic operation.
After loading of dice and submounts in waffle or gel packs, this system allow uninterrupted production with no intervention by an operator.
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